From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible. Through-silicon vias ...
A new technical paper titled “Multifunctional 2D FETs exploiting incipient ferroelectricity in freestanding SrTiO3 ...
The U.S. Department of Energy will contribute $179 million for three new Microelectronics Science Research Centers, which will focus on research into solutions that bridge sensing, edge processing, AI ...
In 2024, hot topics included challenges involving chiplets and heterogeneous integration, AI, data management, MCUs, power semis, software-defined vehicles, sensors, adaptive test, yield tracking, ...
Experts at the Table: The automotive ecosystem is in the midst of an intense evolution as OEMs and tiered providers grapple with how to deal with legacy technology while incorporating ever-increasing ...
A technical paper titled “Recent progress in spin-orbit torque magnetic random-access memory” was recently published by imec. “Spin-orbit torque magnetic random-access memory (SOT-MRAM) offers promise ...
A new technical paper titled “Memory-Centric Computing: Recent Advances in Processing-in-DRAM” was published by researchers at ETH Zurich. “Memory-centric computing aims to enable computation ...
A new technical paper titled “Enabling Efficient Wearables: An Analysis of Low-Power Microcontrollers for Biomedical Applications” was published by researchers at EPFL. “Breakthroughs in ...
The United States is taking the first steps toward bringing larger-scale IC packaging production capabilities back to the U.S. as supply chain concerns and trade tensions grow. The U.S. is among the ...
Battling labor shortages, faster ramp rates, and data overload, the process of designing and building greenfield fabs requires a combination of tech tools, failing earlier approaches and superior ...
When the Meltdown and Spectre vulnerabilities were first uncovered in 2018, they heralded an industry-wide shift in perspective regarding processor security. As the IBM X-Force Threat Intelligence ...